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Equipment
Analytical Instrument
ESD Equipment
Consumable & Material
Parts Overhaul
Semiconductor/LED Equipment
LCD/FPD Equipment


  • Product

    Wire Bonder

  • Label

    KANDE(made in Singapore)

  • Product Description

    Chip and Gold/Copper/Silver bonding

  • Features
    • Gold,Copper and Silver wirebonding
    • Au to Cu easy conversion
    • Fast setup and conversion
    • Segmeneted 1st and 2nd Bond Paramenter for easy Cu bonding
    • Lower gas
    • perfer operation




  • Product

    FOUP/Cassette Cleaner

  • Label

    MYTEK MYFC-S500

  • Product Description

    FOUP/Casssette semi-auto Cleaner

  • Features
    • Manual load.
    • Clean/Dry Automation.
    • DIW Clean/N2 or CDA Dry/IR Heating.
    • Spin Clean.
    • Clean chamber : Class 100.
    • DIW Heating System.
    • Temperature Controlled.
    • HEPA.
    • SEMI S2 certification




  • Product

    FOUP Cleaner

  • Label

    MYTEK MYFC-550

  • Product Description

    FOUP Fully-auto Cleaner

  • Features
    • Auto Clean
    • Clean/Dry chamber
    • 6 axis robot Class 10
    • Clean Lid and Shell.
    • SEMI S2 certification




  • Product

    FOUP Cleaner

  • MYTEK MYFC-1500

  • Product Description

    FOUP Fully-auto (de-AMC) Cleaner

  • Features
    • Auto clean Wash / Dry Chamber vacuum Chamber
    • 6 axis robot
    • ISO Class 2
    • Clean Lid and Shell
    • SEMI S2 certification